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The Amphenol InterCon cLGA land grid array socket system was designed to bring conventional connector material construction to a high performance, low cost socket design. Gold over nickel plated beryllium copper spring contacts guarantee industry understood long term connector performance in a design that also guarantees contact retention and ruggedness during handling and use.

The socket's molded thermoplastic housing acts as a positive stop at full deflection to protect contacts and yield excellent performance during shock and vibration exposure. The product has been shock and vibration tested with heat sink loads to 500 grams.

The cLGA socket is fully qualified under the EIA-540BOAE and Telcordia GR-1217-CORE specifications.

The cLGA product1 is available in standard .050" and 1 millimeter centerline standard configurations. Current industry standard sizes are available in 937, 1089, and 1657 position sizes.

Standard products can be selectively loaded to create custom contact arrays. A two piece frame and insert housing design means that custom frames can be designed and built with low tooling cost and short lead time for specialized applications.

Large contact array sockets are achieved by combining multiple housings in an outer frame for interconnecting high signal count multi chip modules. Current products approach 4000 contacts per device, with 5000 contacts per device now in design.

The cLGA technology is also available as cSTACKTM board to board or flex circuit to board stacking connectors. In these product applications, the cSTACKTM connector is a low cost, high signal integrity, solderless alternative to standard two piece connectors.

Contact Amphenol InterCon Systems for engineering assistance in standard or custom socket and connector design and application.

  1 U.S. Patent number 6,176,707 and 6,217,342. Other patents pending.





Conventional connector material construction - gold over nickel plated beryllium copper contacts, high temperature thermoplastic housings.
Solderless socket termination eliminates thermal stress of soldered socket products, allows field device upgrades.
Patented contact retention feature for positive contact retention during handling and use.
Positive housing stop during contact deflection for contact anti-overstress protection and superior shock and vibration performance.
Custom and standard outer molded frames allow tailored designs for specific applications, or standard frames for cost effective solutions.
Standard .050" and 1 mm centerline contact grid products available.
Selectively loaded standard housings allow custom footprints at low tooling cost.
Low profile design yields a .20 nH mutual inductance.

cLGA Product Specifications

cLGA Socket Application Drawing




Standard cLGA Socket Products:

1mm Centerline,
31 x 31 Position Socket		 .050" Centerline,
33 x 33 Position Socket
1mm Centerline,
41 x 41 Position Socket		 1mm Centerline cSTACKTM
Board Stacking Connector