 Gold over nickel plated beryllium copper spring land grid array socket system. Standard and custom sockets are available. Also available are low profile board and flex stacking connectors. |
 High speed flex circuit connector system allows solderless termination to circuit boards. A gold plated stamped contact system guarantees reliability and low system cost. |
 Wide array of standard and custom high speed, high density cable assembly products - coax, twinax, twisted pair, and controlled impedance ribbon cable are used to create tailored interconnect solutions to high speed, high density applications. |
 Broad portfolio of controlled impedance flex circuit assemblies. Amphenol InterCon application support ranges from initial flex design through customized hardware design for total system solutions. |
 The industry's most complete .050" centerline product family. A broad range of surface, through, and straddle mountable connectors mate in board-to-board, cable-to-board, and flex-to-board configurations. |
 High density, high speed, high reliability medical electronics systems. Amphenol InterCon process and product technologies allow medical products ranging from intravascular thermocouple and thermistors to high speed cable assemblies. |
 1mm centerline density in a reliable pin and socket product. Surface, through, and straddle mountable connectors mate to board connectors, cable assemblies, and flex assemblies. |
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